Electronic power module

ABSTRACT

Electronic power modules are disclosed. In one example, an electronic power module includes a first aluminum substrate, a second aluminum substrate, and a third aluminum substrate arranged in a common plane. The electronic power module includes first gap separating the first aluminum substrate from the second aluminum substrate. The electronic power module includes a second gap separating the second aluminum substrate from the third aluminum substrate. The electronic power module includes a first semiconductor switching component electrically coupled to the first aluminum substrate and the second aluminum substrate. The electronic power module includes a second semiconductor switching component electrically coupled to the second aluminum substrate and the third aluminum substrate.

PRIORITY CLAIM

The present application claims the benefit of priority to U.S. patentapplication Ser. No. 16/851,450 titled “Electronic Power Module,” havinga filing date of Apr. 17, 2020, which is based on and claims priority toU.S. Provisional Application Ser. No. 62/840,636, titled “ElectronicPower Module,” filed on Apr. 30, 2019, which is incorporated herein byreference.

FIELD

The present disclosure relates generally to electronic power modules,and more particularly to electronic power modules for use in high powerapplications, such as, for instance, power conversion, power storagesystems, electric drive control, etc.

BACKGROUND

Electronic power modules can be used in various electrical switchingapplications. For instance, electronic power modules can be used forpower conversion, power storage systems (e.g., connecting/disconnectingof battery storage systems), electric drive control (e.g., forautomotive applications). Power modules can include one or more solidstate switching device(s) (e.g., MOSFETs, IGBTs, etc.). For instance, apower module can include solid state switching device(s) arranged toimplement a bidirectional switch, an inverter bridge, etc. Toaccommodate higher power requirements in electronic power moduleapplications, the solid state device(s) can be implemented on a metalcircuit carrier, such as an aluminum circuit carrier.

SUMMARY

Aspects and advantages of embodiments of the present disclosure will beset forth in part in the following description, or may be learned fromthe description, or may be learned through practice of the embodiments.

One example aspect of the present disclosure is directed to anelectronic power module. The electronic power module includes a firstaluminum substrate operable at a first potential. The electronic powermodule includes a second aluminum substrate operable at a secondpotential. The second aluminum substrate is arranged in a common planewith the first aluminum substrate. The electronic power module includesa third aluminum substrate operable at a third potential. The thirdaluminum substrate is arranged in a common plane with the first aluminumsubstrate and the second aluminum substrate. The electronic power moduleincludes first gap separating the first aluminum substrate from thesecond aluminum substrate. The electronic power module includes a secondgap separating the second aluminum substrate from the third aluminumsubstrate. The electronic power module includes a first semiconductorswitching component electrically coupled to the first aluminum substrateand the second aluminum substrate. The electronic power module includesa second semiconductor switching component electrically coupled to thesecond aluminum substrate and the third aluminum substrate.

These and other features, aspects and advantages of various embodimentswill become better understood with reference to the followingdescription and appended claims. The accompanying drawings, which areincorporated in and constitute a part of this specification, illustrateembodiments of the present disclosure and, together with thedescription, serve to explain the related principles.

BRIEF DESCRIPTION OF THE DRAWINGS

Detailed discussion of embodiments directed to one of ordinary skill inthe art are set forth in the specification, which makes reference to theappended figures, in which:

FIG. 1 depicts an electronic power module according to exampleembodiments of the present disclosure;

FIG. 2 depicts an electronic power module according to exampleembodiments of the present disclosure;

FIG. 3 depicts an electronic power module according to exampleembodiments of the present disclosure;

FIG. 4 depicts an electronic power module according to exampleembodiments of the present disclosure;

FIG. 5 depicts a cross-sectional view of a portion of an electronicpower module according to example embodiments of the present disclosure;

FIG. 6 depicts an electronic power module according to exampleembodiments of the present disclosure;

FIG. 7 depicts an electronic power module according to exampleembodiments of the present disclosure; and

FIG. 8 depicts a flow chart of an example method for manufacturing anelectronic power module according to example embodiments of the presentdisclosure.

DETAILED DESCRIPTION

Reference now will be made in detail to embodiments, one or moreexamples of which are illustrated in the drawings. Each example isprovided by way of explanation of the embodiments, not limitation of thepresent disclosure. In fact, it will be apparent to those skilled in theart that various modifications and variations can be made to theembodiments without departing from the scope or spirit of the presentdisclosure. For instance, features illustrated or described as part ofone embodiment can be used with another embodiment to yield a stillfurther embodiment. Thus, it is intended that aspects of the presentdisclosure cover such modifications and variations.

Example aspects of the present disclosure are directed to electronicpower modules and methods of manufacturing electronic power modules. Theelectronic power modules can have an improved layout for implementinghigh performance power switching technology. The electronic powermodules can be manufacturing according to the example processesdescribed herein using cost effective techniques from rigid aluminumsubstrates to provide high performance electronic power modules.

In some embodiments, the electronic power modules can be used toimplement a bidirectional solid state switch. For instance, a powermodule having semiconductor switching components (e.g., MOSFETs) in ananti-serial configuration can allow for controlling current flow in abidirectional manner. Capability for handling higher currents in powerelectronic modules can be based at least in part by intrinsic on-stateresistance of individual semiconductor switching components. Thisresistance can be scaled down by parallel connection of moresemiconductor switching components. This can increase the size of thearea of the semiconductor switching components connected to the circuitcarrier of the power electronic module. As an example, using bare diechip semiconductor switching components with a typical on-stateresistance of 1.3 mOhm per chip at 25° C. can lead to a total on-stateresistance of 0.65 mOhm at 25° C. for four chips connected in parallelper module. At junction temperature of the semiconductor switchingcomponents at 175° C., this can least to about one kilowatt powerdissipation at about 900 amps current flow.

Electronic power modules for implementing a bidirectional solid stateswitch can include a first semiconductor switching component and asecond semiconductor switching component arranged in an anti-serialconfiguration. The electronic power modules can include a plurality ofanti-serial connected first and second semiconductor switchingcomponents arranged in parallel. The semiconductor switching componentscan be arranged on co-planar aluminum substrate sub-elements with gapsbetween the sub-elements as will be described in detail below.

In some embodiments, the electronic power modules can be used for singlephase inverter bridges. These power modules can be used to convert DCpower to AC power in various power systems, such as various electricalmotor drive applications (e.g., automotive electrical motor driveapplications). The power modules can also be used in other powerconverters, such as DC-DC power converts, AC to DC power converts, etc.The bridge can be a full bridge, half bridge, H-bridge, asymmetricH-bridge, etc. by rearranging components on the power module.

The electronic power modules can include a first semiconductor switchingcomponent and a second semiconductor switching component arranged in aserial configuration. The electronic power modules can include aplurality of serial connected first and second semiconductor switchingcomponents connected in a parallel. The semiconductor switchingcomponents can be arranged on co planar aluminum substrate sub-elementswith gaps between the sub-elements as will be described in detail below.

According to example aspects of the present disclosure, an electronicpower module suitable for use in the above described applications can bemade from rigid aluminum substrates. The rigid aluminum substrates canhave a thickness, for instance, in the range of about 0.5 mm to about3.5 mm, such as about 2.0 mm. As used herein, the use of the term“about” in conjunction with a numerical value refers to within 15% ofthe stated numerical value.

The aluminum substrate can be punched into individual sub-elements, suchas a first aluminum substrate, a second aluminum substrate, and a thirdaluminum substrate. The sub-elements can act as current busbars for theelectronic power module. During the manufacturing process after theinitial punching, the first aluminum substrate, the second aluminumsubstrate, and the third aluminum substrate can be connected by bridges.The first aluminum substrate, the second aluminum substrate, and thethird aluminum substrate can define substrate areas that correspond todrain, source, and gate regions for connecting semiconductor switchingcomponents. Thick film screen printing processes can print an electricalcircuit (e.g., gate driving circuitry, conductive tracks, etc.) on oneor more of the aluminum substrates. A surface mount assembly process canattach electrical components (e.g., passive electrical components, suchas resistors, Zener diodes, capacitors, pin connectors, bond preforms),sensors (e.g., shunt resistors, hall sensors, etc.) and/or semiconductorswitching components (e.g., MOSFETs, IGBTs, FETs, SiC MOSFETs, SiCShottky diodes, GaN HEMT, etc.)) to the aluminum substrates.

After assembly, the power module can be mechanically stabilized byattaching the substrate to a heat spreader (e.g., a conductive plate,such as an aluminum plate) via an isolating layer coupled between thealuminum substrate and the heat spreader. The isolating layer can be,for instance, adhesive tape, glue layer, gap filler, etc.

A multiple pin connector with metallized pins can be soldered orotherwise connected to the power module. In addition and/or in thealternative, wire bond or ribbon bond preforms can be implemented forwire bonding or ribbon bonding the circuit carrier to a control circuit(e.g., a separate circuit carrier associated with control for theelectronic power module.

The bridges between the aluminum substrate sub-elements can be punchedto create a gap between the aluminum sub-elements. The gap can be an airgap or can be filled with an isolating material (e.g., epoxy resin,silicone, potting compound, etc.). The gap can have a size andconfiguration to assure proper insulation standards between the aluminumsubstrate sub-elements. The power module can be encased or otherwisepackaged in a packaging material (e.g., plastic material).

Aspects of the present disclosure provide a number of technical effectsand benefits. For instance, the apparatus and methods according toexample aspects of the present disclosure can provide for higher designflexibility for single side cooled electronic power modules. Theelectronic power modules can be manufactured using relatively costeffective techniques using an aluminum substrate which can also providehigh performance for thermal and electrical conductivity. The methodsfor manufacturing the electronic power modules can be implemented in ashort production process with lower high volume production risks. Theconfiguration of the electronic power module can provide for flexibilityin the sourcing of semiconductor components used in the electronic powermodule.

The electronic power module includes a first aluminum substrate operableat a first potential. The electronic power module includes a secondaluminum substrate operable at a second potential. The second aluminumsubstrate is arranged in a common plane with the first aluminumsubstrate. The electronic power module includes a third aluminumsubstrate operable at a third potential. The third aluminum substrate isarranged in a common plane with the first aluminum substrate and thesecond aluminum substrate. The electronic power module includes firstgap separating the first aluminum substrate from the second aluminumsubstrate. The electronic power module includes a second gap separatingthe second aluminum substrate from the third aluminum substrate. Theelectronic power module includes a first semiconductor switchingcomponent electrically coupled to the first aluminum substrate and thesecond aluminum substrate. The electronic power module includes a secondsemiconductor switching component electrically coupled to the secondaluminum substrate and the third aluminum substrate.

In some embodiments, the first semiconductor switching component and thesecond semiconductor switching component are arranged in an anti-serialconnection. For instance, the first aluminum substrate provides a drainconnection for the first semiconductor switching component. The thirdaluminum substrate provides a drain connection for the secondsemiconductor switching component. The second aluminum substrateprovides a gate connection and a source connection for the firstsemiconductor switching component and a gate connection and a sourceconnection for the second semiconductor switching component. In someapplications, the electronic power module is configured as abidirectional solid state switch.

The second aluminum substrate can be arranged between the first aluminumsubstrate and the third aluminum substrate. In some embodiments, controlcircuitry can be disposed on the second aluminum substrate.

In particular implementations, the first semiconductor switchingcomponent includes a drain connection pad, a source connection pad, anda gate connection pad arranged on a same side of a first semiconductorpackage for the first semiconductor switching component. The secondsemiconductor switching component comprises a drain connection pad, asource connection pad, and a gate connection pad arranged on a same sideof a second semiconductor package for the second semiconductor switchingcomponent. The first semiconductor package spans the first gap and thesecond semiconductor package spans the second gap.

The drain connection pad of the first semiconductor switching componentis die attached to the first aluminum substrate. The drain connectionpad of the second semiconductor switching component is die attached tothe third aluminum substrate. The gate connection pad and the sourceconnection pad of the first semiconductor switching component is dieattached to the second aluminum substrate. The gate connection pad andthe source connection pad of the second semiconductor switchingcomponent is die attached to the second aluminum substrate.

In particular implementations, the first semiconductor switchingcomponent includes a drain connection pad, a source connection pad, anda gate connection pad. The drain connection pad and the gate connectionpad arranged on opposite sides of a first semiconductor package for thefirst semiconductor switching component. The second semiconductorswitching component comprises a drain connection pad, a sourceconnection pad, and a gate connection pad. The drain connection pad andthe gate connection pad arranged on opposite sides of a secondsemiconductor package for the second semiconductor switching component.

The drain connection pad of the first semiconductor switching componentis die attached to the first aluminum substrate. The drain connectionpad of the second semiconductor switching component is die attached tothe third aluminum substrate. The gate connection pad and the sourceconnection pad of the first semiconductor switching component are wirebonded or ribbon bonded to the second aluminum substrate. The gateconnection pad and the source connection pad of the second semiconductorswitching component are wire bonded or ribbon bonded to the secondaluminum substrate.

In some embodiments, the first semiconductor switching component and thesecond semiconductor switching component are arranged in a serialconnection. For instance, the first aluminum substrate provides a drainconnection for the first semiconductor switching component. The secondaluminum substrate provides a source connection and a gate connectionfor the first semiconductor switching component. The second aluminumsubstrate provides a drain connection and a source connection for thesecond semiconductor switching component. The third aluminum substrateprovides a gate connection for the second semiconductor switchingcomponent. The second aluminum substrate can be arranged between thefirst aluminum substrate and the third aluminum substrate. In someapplications, the electronic power module is configured as a singlephase inverter bridge.

In particular implementations, the first semiconductor switchingcomponent includes a drain connection pad, a source connection pad, anda gate connection pad arranged on a same side of a first semiconductorpackage for the first semiconductor switching component. The secondsemiconductor switching component comprises a drain connection pad, asource connection pad, and a gate connection pad arranged on a same sideof a second semiconductor package for the second semiconductor switchingcomponent. The first semiconductor package spans the first gap and thesecond semiconductor package spans the second gap.

The drain connection pad of the first semiconductor switching componentis die attached to the first aluminum substrate. The connection pad andthe gate connection pad of the first semiconductor switching componentis die attached to the second aluminum substrate. The drain connectionpad of the second semiconductor switching component is die attached tothe second aluminum substrate. The source connection pad and the gateconnection pad is die attached to the third aluminum substrate.

In particular implementations, the first semiconductor switchingcomponent includes a drain connection pad, a source connection pad, anda gate connection pad. The drain connection pad and the gate connectionpad arranged on opposite sides of a first semiconductor package for thefirst semiconductor switching component. The second semiconductorswitching component comprises a drain connection pad, a sourceconnection pad, and a gate connection pad. The drain connection pad andthe gate connection pad arranged on opposite sides of a secondsemiconductor package for the second semiconductor switching component.

The drain connection pad of the first semiconductor switching componentis die attached to the first aluminum substrate. The gate connection padof the first semiconductor switching component is wire bonded or ribbonbonded to the second aluminum substrate. The source connection pad ofthe first semiconductor switching component is wire bonded or ribbonbonded to the second aluminum substrate. The drain connection pad of thesecond semiconductor switching component is die attached to the secondaluminum substrate. The source connection pad of the secondsemiconductor switching component is wire bonded or ribbon bonded to thethird aluminum substrate. The gate connection pad of the secondsemiconductor switching component is wire bonded or ribbon bonded to thethird aluminum substrate.

In some embodiments, the electronic power module can further include aconnector coupled to the first aluminum substrate, the second aluminumsubstrate, and the third aluminum substrate. The first aluminumsubstrate, the second aluminum substrate, and the third aluminumsubstrate can each be a bus bar. Aa thickness of the first aluminumsubstrate, the second aluminum substrate, and the third aluminumsubstrate can be in the range of about 0.5 mm to about 3.5 mm.

In some embodiments, the first gap and the second gap each include air.In some embodiments, the first gap and the second gap each include aninsulating material.

In some embodiments, the first aluminum substrate, the second aluminumsubstrate, and the third aluminum substrate are attached to a heatspreader via an isolating layer. The isolating layer can be, forinstance, an adhesive tape.

In some embodiments, the first semiconductor switching component and thesecond semiconductor switching component each include a MOSFET, IGBT,SiC MOSFET, SiC Shottky diode, or GaN HEMT. The first aluminumsubstrate, the second aluminum substrate, and the third aluminumsubstrate can be treated with a pulsed laser pretreatment process.

Another example embodiment of the present disclosure is directed to amethod of manufacturing an electronic power module. The method includespunching the first aluminum substrate, the second aluminum substrate,and the third aluminum substrate from a sheet of aluminum such that thefirst gap separates the first aluminum substrate from the secondaluminum substrate and the second gap separates the second aluminumsubstrate from the third aluminum substrate: the first aluminumsubstrate connected to the second aluminum substrate by one or morebridges; the second aluminum substrate connected to the third aluminumsubstrate by one or more bridges; The method includes screen printingone or more circuit components on the first aluminum substrate, thesecond aluminum substrate, and the third aluminum substrate. The methodincludes connecting the first semiconductor switching component to thefirst aluminum substrate and the second aluminum substrate. The methodincludes connecting the second semiconductor switching component to thesecond aluminum substrate and the third aluminum substrate. The methodincludes attaching the first aluminum substrate, second aluminumsubstrate, and the third aluminum substrate to a heat spreader via anisolating layer. The method includes punching the one or more bridgesconnecting the first aluminum substrate and the second aluminumsubstrate and the one or more bridges connecting the second aluminumsubstrate and the third aluminum substrate to separate the firstaluminum substrate from the second aluminum substrate and to separatethe second aluminum substrate from the third aluminum substrate. Themethod can include covering the first aluminum substrate, the secondaluminum substrate, and the third aluminum substrate with a packagingmaterial.

FIG. 1 depicts an electronic power module 100 according to exampleembodiments of the present disclosure. The power module 100 includesthree aluminum substrate sub-elements. More particularly, the powermodule 100 includes a first aluminum substrate 110, a second aluminumsubstrate 120, and a third aluminum substrate 130. The first aluminumsubstrate 110, the second aluminum substrate 120, and third aluminumsubstrate 130 are arranged in a common plane. As shown, the secondaluminum substrate 120 is arranged between the first aluminum substrate110 and the third aluminum substrate 130. Each of the aluminum substratesub-elements (e.g., first aluminum substrate 110, second aluminumsubstrate 120, and third aluminum substrate 130) can be rigid aluminumhaving a thickness in the range of about 0.5 mm to about 3.5 mm, such asabout 2.0 mm.

A first gap 115 can be disposed between the first aluminum substrate 110and the second aluminum substrate 120. A second gap 125 can be disposedbetween the second aluminum substrate 120 and the third aluminumsubstrate 130. The first gap 115 and the second gap 125 can be an airgap. In some embodiments, the first gap 115 and the second gap 125 canbe at least partially filled (e.g., completely filled) with an isolatingmaterial (e.g., insulating material). The isolating material can be, forinstance, an epoxy resin, silicone, a potting compound, or otherisolating material. The first gap 115 and the second gap 125 can have asize to meet insulation standards (e.g., EN60664-1, UL 840, etc.).

The first aluminum substrate 110 can include a connection 112. Theterminal connection 112 can be used to mechanically mount the electronicpower module 100. The third aluminum substrate 130 can include aconnection 132. The connection 132 can be used to mechanically mount theelectronic power module 100.

The power module 100 can include a plurality of semiconductor switchingcomponents, including a first semiconductor switching component 150 anda second semiconductor switching component 160 arranged in anti-serialconfiguration to implement a bidirectional solid state switch. In theexample embodiment of FIG. 2 , eight semiconductor switching componentsare illustrated (four parallel connections of anti-serial connectedsemiconductor switching components). However, those of ordinary skill inthe art, using the disclosures provided herein, will understand thatmore or fewer semiconductor switching components can be used withoutdeviating from the scope of the present disclosure.

The semiconductor switching components in FIG. 1 can be, for instance,MOSFETs having connection pads (e.g., gate connection pad, drainconnection pad, and source connection pad, arranged on the same side ofthe semiconductor switching component. For example, a firstsemiconductor switching component 150 can include a drain connection pad152, a source connection pad 154, and a gate connection pad 156 arrangedon the same side of the package associated with the semiconductorswitching component 150. Similarly, the second semiconductor switchingcomponent 160 can include a drain connection pad 162, a sourceconnection pad 164, and a gate connection pad 166 arranged on the sameside of the package associated with the semiconductor switchingcomponent 160. In example embodiments, the first semiconductor switchingcomponent 150 and the second semiconductor switching component 160 canbe an HSOF-8 chip, JEDEC MO-299 package, TO-LL package, etc.

The first aluminum substrate 110 can provide a drain potential for thefirst semiconductor switching component 150. More particularly, thefirst aluminum substrate 110 can provide a drain connection for thefirst semiconductor switching component 150. For instance, the drainconnection pad 152 of the first semiconductor switching component 150can be die attached (e.g., soldered) to first aluminum substrate 110.

The third aluminum substrate 110 can provide a drain potential for thesecond semiconductor switching component 160. More particularly, thethird aluminum substrate 130 can provide a drain connection for thesecond semiconductor switching component 160. For instance, the drainconnection pad 162 of the semiconductor switching component 160 can bedie attached (e.g., soldered) to the third aluminum substrate 130.

The second aluminum substrate 120 can provide a source potential forboth the first semiconductor switching component 150 and the secondsemiconductor switching component 160. More particularly, the secondaluminum substrate 120 can provide a source connection for the firstsemiconductor switching component 150 and the second semiconductorswitching component 160. For instance, the source connection pad 154 ofthe first semiconductor switching component 150 can be die attached(e.g., soldered) to the second aluminum substrate 120. The sourceconnection pad 164 of the second semiconductor switching component 160can be die attached (e.g., soldered) to the second aluminum substrate120.

The second aluminum substrate can also include control circuitry (e.g.,gate tracks passive components, sensors, traces, etc.) for control ofthe electronic power module 100. The control circuitry can be screenprinted onto the aluminum substrate 120 as will be discussed in moredetail below. The gate connection pad 156 of the first semiconductorswitching component 150 can be die attached (e.g., soldered) to thesecond aluminum substrate 120. The gate connection pad 166 of the secondsemiconductor switching component 160 can be die attached (e.g.,soldered) to the second aluminum substrate.

A connector 170 can be coupled to the first aluminum substrate 110, thesecond aluminum substrate 120, and the third aluminum substrate 130. Theconnector 170 can include metal pins for providing power and controlsignals to the power module 100. The connector 170 can be configured toprovide the drain potential to the first aluminum substrate 110 and thethird aluminum substrate 130. The connector 170 can provide the sourcepotential and control signals to circuitry on the second aluminumsubstrate 120. Other suitable techniques can be used to provide powerand control signals to the power module 100 without deviating from thescope of the present disclosure.

FIG. 2 depicts an electronic power module 200 according to exampleembodiments of the present disclosure. The power module 200 includesthree aluminum substrate sub-elements. More particularly, the powermodule 200 includes a first aluminum substrate 110, a second aluminumsubstrate 120, and a third aluminum substrate 130. The first aluminumsubstrate 110, the second aluminum substrate 120, and third aluminumsubstrate 130 are arranged in a common plane. As shown, the secondaluminum substrate 120 is arranged between the first aluminum substrate110 and the third aluminum substrate 130. Each of the aluminum substratesub-elements (e.g., first aluminum substrate 110, second aluminumsubstrate 120, and third aluminum substrate 130) can be rigid aluminumhaving a thickness in the range of about 0.5 mm to about 3.5 mm, such asabout 2.0 mm.

A first gap 115 can be disposed between the first aluminum substrate 110and the second aluminum substrate 120. A second gap 125 can be disposedbetween the second aluminum substrate 120 and the third aluminumsubstrate 130. The first gap 115 and the second gap 125 can be an airgap. In some embodiments, the first gap 115 and the second gap 125 canbe at least partially filled (e.g., completely filled) with an isolatingmaterial (e.g., insulating material). The isolating material can be, forinstance, an epoxy resin, silicone, a potting compound, or otherisolating material. The first gap 115 and the second gap 125 can have asize to meet insulation standards (e.g., EN60664-1, UL 840, etc.).

The first aluminum substrate 110 can include a connection 112. Theconnection 112 can be used to mechanically mount the electronic powermodule 200. The third aluminum substrate 130 can include a connection132. The connection 132 can be used to mechanically mount the electronicpower module 200.

The power module 200 can include a plurality of semiconductor switchingcomponents, including a first semiconductor switching component 210 anda second semiconductor switching component 220 arranged in anti-serialconfiguration to implement a bidirectional solid state switch. In theexample embodiment of FIG. 2 , eight semiconductor switching componentsare illustrated (four parallel connections of anti-serial connectedsemiconductor switching components). However, those of ordinary skill inthe art, using the disclosures provided herein, will understand thatmore or fewer semiconductor switching components can be used withoutdeviating from the scope of the present disclosure.

The semiconductor switching components in FIG. 2 can be, for instance,bare die semiconductor switching components (e.g., MOSFETs). Thesemiconductor switching components in FIG. 2 can have a drain connectionpad on one side of the component and gate and source connections on theopposing side of the component. For example, a first semiconductorswitching component 210 can include a drain connection pad (not shown)on a first side of the component 210. The first semiconductor switchingcomponent 210 can include a source connection pad 214 and a gateconnection pad 216 arranged on an opposite side of the firstsemiconductor switching component 210. Similarly, a second semiconductorswitching component 220 can include a drain connection pad (not shown)on a first side of the component 220. The second semiconductor switchingcomponent 220 can include a source connection pad 224 and a gateconnection pad 226 arranged on an opposite side of the secondsemiconductor switching component 220

The first aluminum substrate 110 can provide a drain potential for thesemiconductor switching component 210. More particularly, the firstaluminum substrate 110 can provide a drain connection for the firstsemiconductor switching component 210. For instance, the drainconnection pad of the first semiconductor switching component 210 can besoldered or otherwise die attached to first aluminum substrate 110.

The third aluminum substrate 110 can provide a drain potential for thesemiconductor switching component 220. More particularly, the thirdaluminum substrate 130 can provide a drain connection for the secondsemiconductor switching component 220. For instance, the drainconnection pad of the second semiconductor switching component 220 canbe soldered or otherwise die attached to the third aluminum substrate130.

The second aluminum substrate 120 can provide a source potential forboth the first semiconductor switching component 210 and the secondsemiconductor switching component 220. More particularly, the secondaluminum substrate 120 can provide a source connection for the firstsemiconductor switching component 210 and the second semiconductorswitching component 220. For instance, the source connection pad 216 ofthe first semiconductor switching component 210 can be wire bonded orribbon bonded (e.g., via bond 225) to the second aluminum substrate 120.The source connection pad 226 of the second semiconductor switchingcomponent 220 can be wire bonded or ribbon bonded (e.g., via bond 225)to the second aluminum substrate 120.

The second aluminum substrate can also include control circuitry (e.g.,gate tracks passive components, sensors, traces, etc.) for control ofthe electronic power module 200. The control circuitry can be screenprinted onto the aluminum substrate 120 as will be discussed in moredetail below. The gate connection pad 218 of the first semiconductorswitching component 210 can be wire bonded or ribbon bonded (e.g., viabond 225) to the second aluminum substrate 120. The gate connection pad228 of the second semiconductor switching component 220 can be wirebonded or ribbon bonded (e.g., via bond 225) to the second aluminumsubstrate 120.

A connector 170 can be coupled to the first aluminum substrate 110, thesecond aluminum substrate 120, and the third aluminum substrate 130. Theconnector 170 can include metal pins for providing power and controlsignals to the power module 200. The connector 170 can be configured toprovide the drain potential to the first aluminum substrate 110 and thethird aluminum substrate 130. The connector 170 can provide the sourcepotential and control signals to circuitry on the second aluminumsubstrate 120. Other suitable techniques can be used to provide powerand control signals to the power module 200 without deviating from thescope of the present disclosure.

FIG. 3 depicts an electronic power module 250 according to exampleembodiments of the present disclosure. The power module 250 includesthree aluminum substrate sub-elements. More particularly, the powermodule 250 includes a first aluminum substrate 110, a second aluminumsubstrate 120, and a third aluminum substrate 130. The first aluminumsubstrate 110, the second aluminum substrate 120, and third aluminumsubstrate 130 are arranged in a common plane. As shown, the secondaluminum substrate 120 is arranged between the first aluminum substrate110 and the third aluminum substrate 130. Each of the aluminum substratesub-elements (e.g., first aluminum substrate 110, second aluminumsubstrate 120, and third aluminum substrate 130) can be rigid aluminumhaving a thickness in the range of about 0.5 mm to about 3.5 mm, such asabout 2.0 mm.

A first gap 115 can be disposed between the first aluminum substrate 110and the second aluminum substrate 120. A second gap 125 can be disposedbetween the second aluminum substrate 120 and the third aluminumsubstrate 130. The first gap 115 and the second gap 125 can be an airgap. In some embodiments, the first gap 115 and the second gap 125 canbe at least partially filled (e.g., completely filled) with an isolatingmaterial (e.g., insulating material). The isolating material can be, forinstance, an epoxy resin, silicone, a potting compound, or otherisolating material. The first gap 115 and the second gap 125 can have asize to meet insulation standards (e.g., EN60664-1, UL 840, etc.).

The first aluminum substrate 110 can include a connection 112. Theterminal connection 112 can be used to mechanically mount the electronicpower module 100. The third aluminum substrate 130 can include aconnection 132. The connection 132 can be used to mechanically mount theelectronic power module 250.

The power module 250 can include a plurality of semiconductor switchingcomponents, including a first semiconductor switching component 150 anda second semiconductor switching component 160 arranged in a serialconfiguration to implement an inverter bridge. In the example embodimentof FIG. 3 , eight semiconductor switching components are illustrated(four parallel connections of serial connected semiconductor switchingcomponents). However, those of ordinary skill in the art, using thedisclosures provided herein, will understand that more or fewersemiconductor switching components can be used without deviating fromthe scope of the present disclosure.

The semiconductor switching components in FIG. 3 can be, for instance,MOSFETs having connection pads (e.g., gate connection pad, drainconnection pad, and source connection pad, arranged on the same side ofthe semiconductor switching component. For example, a firstsemiconductor switching component 150 can include a drain connection pad152, a source connection pad 154, and a gate connection pad 156 arrangedon the same side of the package associated with the semiconductorswitching component 150. Similarly, the second semiconductor switchingcomponent 160 can include a drain connection pad 162, a sourceconnection pad 164, and a gate connection pad 166 arranged on the sameside of the package associated with the semiconductor switchingcomponent 160. In example embodiments, the first semiconductor switchingcomponent 150 and the second semiconductor switching component 160 canbe an HSOF-8 chip, JEDEC MO-299 package, TO-LL package, etc.

The first aluminum substrate 110 can provide a drain potential for thefirst semiconductor switching component 150. More particularly, thefirst aluminum substrate 110 can provide a drain connection for thefirst semiconductor switching component 150. For instance, the drainconnection pad 152 of the first semiconductor switching component 150can be die attached (e.g., soldered) to first aluminum substrate 110.

The second aluminum substrate 120 can provide a drain potential for thesecond semiconductor switching component 160. More particularly, thesecond aluminum substrate 120 can provide a drain connection for thesecond semiconductor switching component 160. For instance, the drainconnection pad 162 of the semiconductor switching component 160 can bedie attached (e.g., soldered) to the second aluminum substrate 120.

The second aluminum substrate 120 can provide a source potential for thefirst semiconductor switching component 150. More particularly, thesecond aluminum substrate 120 can provide a source connection for thefirst semiconductor switching component 150. For instance, the sourceconnection pad 154 of the first semiconductor switching component 150can be die attached (e.g., soldered) to the second aluminum substrate120.

The second aluminum substrate can also include control circuitry (e.g.,gate tracks passive components, sensors, traces, etc.) for control ofthe electronic power module 250. The control circuitry can be screenprinted onto the aluminum substrate 120 as will be discussed in moredetail below. The gate connection pad 156 of the first semiconductorswitching component 150 can be die attached (e.g., soldered) to thesecond aluminum substrate 120.

The third aluminum substrate 130 can provide a source potential for thesecond semiconductor switching component 160. More particularly, thethird aluminum substrate 130 can provide a source connection for thesecond semiconductor switching component 160. For instance, the sourceconnection pad 164 of the second semiconductor switching component 160can be die attached (e.g., soldered) to the third aluminum substrate130.

The third aluminum substrate 130 can also include control circuitry(e.g., gate tracks passive components, sensors, traces, etc.) forcontrol of the electronic power module 250. The control circuitry can bescreen printed onto the aluminum substrate 130 as will be discussed inmore detail below. The gate connection pad 166 of the secondsemiconductor switching component 160 can be die attached (e.g.,soldered) to the third aluminum substrate 130.

A connector 170 can be coupled to the first aluminum substrate 110, thesecond aluminum substrate 120, and the third aluminum substrate 130. Theconnector 170 can include metal pins for providing power and controlsignals to the power module 250. The connector 170 can be configured toprovide the drain potential to the first aluminum substrate 110 and thethird aluminum substrate 130. The connector 170 can provide the sourcepotential and control signals to circuitry on the second aluminumsubstrate 120. Other suitable techniques can be used to provide powerand control signals to the power module 100 without deviating from thescope of the present disclosure.

FIG. 4 depicts an electronic power module 270 according to exampleembodiments of the present disclosure. The power module 270 includesthree aluminum substrate sub-elements. More particularly, the powermodule 270 includes a first aluminum substrate 110, a second aluminumsubstrate 120, and a third aluminum substrate 130. The first aluminumsubstrate 110, the second aluminum substrate 120, and third aluminumsubstrate 130 are arranged in a common plane. As shown, the secondaluminum substrate 120 is arranged between the first aluminum substrate110 and the third aluminum substrate 130. Each of the aluminum substratesub-elements (e.g., first aluminum substrate 110, second aluminumsubstrate 120, and third aluminum substrate 130) can be rigid aluminumhaving a thickness in the range of about 0.5 mm to about 3.5 mm, such asabout 2.0 mm.

A first gap 115 can be disposed between the first aluminum substrate 110and the second aluminum substrate 120. A second gap 125 can be disposedbetween the second aluminum substrate 120 and the third aluminumsubstrate 130. The first gap 115 and the second gap 125 can be an airgap. In some embodiments, the first gap 115 and the second gap 125 canbe at least partially filled (e.g., completely filled) with an isolatingmaterial (e.g., insulating material). The isolating material can be, forinstance, an epoxy resin, silicone, a potting compound, or otherisolating material. The first gap 115 and the second gap 125 can have asize to meet insulation standards (e.g., EN60664-1, UL 840, etc.).

The first aluminum substrate 110 can include a connection 112. Theterminal connection 112 can be used to mechanically mount the electronicpower module 100. The third aluminum substrate 130 can include aconnection 132. The connection 132 can be used to mechanically mount theelectronic power module 270.

The power module 270 can include a plurality of semiconductor switchingcomponents, including a first semiconductor switching component 210 anda second semiconductor switching component 220 arranged in a serialconfiguration to implement an inverter bridge. In the example embodimentof FIG. 4 , eight semiconductor switching components are illustrated(four parallel connections of serial connected semiconductor switchingcomponents). However, those of ordinary skill in the art, using thedisclosures provided herein, will understand that more or fewersemiconductor switching components can be used without deviating fromthe scope of the present disclosure.

The semiconductor switching components in FIG. 4 can be, for instance,bare die semiconductor switching components (e.g., MOSFETs). Thesemiconductor switching components in FIG. 4 can have a drain connectionpad on one side of the component and gate and source connections on theopposing side of the component. For example, a first semiconductorswitching component 210 can include a drain connection pad (not shown)on a first side of the component 210. The first semiconductor switchingcomponent 210 can include a source connection pad 214 and a gateconnection pad 216 arranged on an opposite side of the firstsemiconductor switching component 210. Similarly, a second semiconductorswitching component 220 can include a drain connection pad (not shown)on a first side of the component 220. The second semiconductor switchingcomponent 220 can include a source connection pad 224 and a gateconnection pad 226 arranged on an opposite side of the secondsemiconductor switching component 220

The first aluminum substrate 110 can provide a drain potential for thefirst semiconductor switching component 210. More particularly, thefirst aluminum substrate 110 can provide a drain connection for thefirst semiconductor switching component 210. For instance, the drainconnection pad (not shown) of the first semiconductor switchingcomponent 150 can be die attached (e.g., soldered) to first aluminumsubstrate 110.

The second aluminum substrate 120 can provide a drain potential for thesecond semiconductor switching component 220. More particularly, thesecond aluminum substrate 120 can provide a drain connection for thesecond semiconductor switching component 220. For instance, the drainconnection pad (not shown) of the semiconductor switching component 160can be die attached (e.g., soldered) to the second aluminum substrate120.

The second aluminum substrate 120 can provide a source potential for thefirst semiconductor switching component 210. More particularly, thesecond aluminum substrate 120 can provide a source connection for thefirst semiconductor switching component 210. For instance, the sourceconnection pad 216 of the first semiconductor switching component 210can be wire bonded or ribbon bonded (e.g., via bond 225) to the secondaluminum substrate 120.

The second aluminum substrate 120 can also include control circuitry(e.g., gate tracks passive components, sensors, traces, etc.) forcontrol of the electronic power module 270. The control circuitry can bescreen printed onto the aluminum substrate 120 as will be discussed inmore detail below. The gate connection pad 218 of the firstsemiconductor switching component 210 can be wire bonded or ribbonbonded (e.g., via bond 225) to the second aluminum substrate 120.

The third aluminum substrate 130 can provide a source potential for thesecond semiconductor switching component 220. More particularly, thethird aluminum substrate 130 can provide a source connection for thesecond semiconductor switching component 220. For instance, the sourceconnection pad 226 of the second semiconductor switching component 160can be wire bonded or ribbon bonded (e.g., via bond 225) to the thirdaluminum substrate 130.

The third aluminum substrate 130 can also include control circuitry(e.g., gate tracks passive components, sensors, traces, etc.) forcontrol of the electronic power module 250. The control circuitry can bescreen printed onto the aluminum substrate 130 as will be discussed inmore detail below. The gate connection pad 228 of the secondsemiconductor switching component 220 can be wire bonded or ribbonbonded (e.g., via bond 225) to the third aluminum substrate 130.

A connector 170 can be coupled to the first aluminum substrate 110, thesecond aluminum substrate 120, and the third aluminum substrate 130. Theconnector 170 can include metal pins for providing power and controlsignals to the power module 250. The connector 170 can be configured toprovide the drain potential to the first aluminum substrate 110 and thethird aluminum substrate 130. The connector 170 can provide the sourcepotential and control signals to circuitry on the second aluminumsubstrate 120. Other suitable techniques can be used to provide powerand control signals to the power module 100 without deviating from thescope of the present disclosure.

FIG. 5 depicts a cross-sectional view of a portion of the power module200 according to example embodiments of the present disclosure. Asshown, the power module 200 includes a semiconductor switching component210 that is die attached to a first aluminum substrate 110. Moreparticularly, the semiconductor switching component is die attached to afilm metallization layer 113 (e.g., copper, silver, etc.) on the firstaluminum substrate 110 via a solder layer 212. A gate connection pad 216(or other connection) of the first semiconductor switching component 210is wire bonded (e.g., via wire bond 225) to a connection 227 (e.g.,associated with gate track, gate driver, etc.) on the second aluminumsubstrate 120. A gap 115 separates the first aluminum substrate 110 fromthe second aluminum substrate 120.

The first aluminum substrate 110 and the second aluminum substrate 120can be disposed on an optional heat spreader 194. The heat spreader 194can be, for instance, an aluminum sheet having a thickness in the rangeof about 4 mm to about 6 mm. The first aluminum substrate 110 and thesecond aluminum substrate 120 can be attached to the heat spreader 194via an isolating layer 192. The isolating layer 192 can be, for instanceadhesive tape, glue layer, gap filler, etc.

FIG. 6 depicts an electronic power module 100 after it has been at leastpartially encased in packaging 195 (e.g., plastic packaging). As shown,the connector 170 can remain exposed for connection to power source,control boards, etc. In additions, connectors 112 and 132 can remainexposed for mechanical and/or electrical connection of the power module100.

FIG. 7 depicts a modified construction of an electronic power module 300according to example embodiments of the present disclosure. The powermodule 300 includes three aluminum substrate sub-elements. Moreparticularly, the power module 300 includes a first aluminum substrate110, a second aluminum substrate 120, and a third aluminum substrate130. The first aluminum substrate 110, the second aluminum substrate120, and third aluminum substrate 130 are arranged in a common plane. Asshown, the second aluminum substrate 120 is arranged between the firstaluminum substrate 110 and the third aluminum substrate 130. Each of thealuminum substrate sub-elements (e.g., first aluminum substrate 110,second aluminum substrate 120, and third aluminum substrate 130) can berigid aluminum having a thickness in the range of about 0.5 mm to about3.5 mm.

A first gap 115 can be disposed between the first aluminum substrate 110and the second aluminum substrate 120. A second gap 125 can be disposedbetween the second aluminum substrate 120 and the third aluminumsubstrate 130. The first gap 115 and the second gap 125 can be an airgap. In some embodiments, the first gap 115 and the second gap 125 canbe at least partially filled (e.g., completely filled) with an isolatingmaterial (e.g., insulating material). The isolating material can be, forinstance, an epoxy resin, silicone, a potting compound, or otherisolating material. The first gap 115 and the second gap 125 can have asize to meet insulation standards (e.g., EN60664-1, UL 840, etc.).Semiconductor switching components can be arranged on the electronicpower module in a manner similar to that described with reference toFIGS. 1-4 .

As shown in FIG. 7 , the second aluminum substrate 120 has a widenedportion 123 to accommodate the entire footprint of the connector 170.Appropriate electrical connections from the connector 170 to the firstaluminum substrate 110 can be implemented using electrical conductor 304(e.g., bond). Appropriate electrical connections from the connector 170to the third aluminum substrate 130 can be implemented using electricalconductor 302 (e.g., bond). This configuration can allow completeovermolding of the power module as plastic compound does not flowunderneath the connector component. In addition, the connector area canbe sealed by pressing on a flat substrate area around the connector 170.

FIG. 8 depicts an overview of an example method 400 for manufacturing anelectronic power module according to example embodiments of the presentdisclosure. The method 400 can be used to manufacture any of theelectronic power modules described herein, including the electronicpower modules described in FIGS. 1-7 . FIG. 8 depicts steps performed ina particular order for purposes of illustration and discussion. Those ofordinary skill in the art, using the disclosures provided herein, willunderstand that various steps of any of the methods described herein canbe modified, rearranged, omitted, include steps not illustrated, and/orexpanded in various ways without deviating from the scope of the presentdisclosure.

At (402), a rigid aluminum metal substrate can be provided. Thesubstrate can have a thickness, for instance, in the range of about 0.5mm to about 3.5 mm, such as about 2.0 mm.

At (404), the method can include punching the aluminum substrate to withthe required layout to generate the aluminum substrate sub-elementsseparated by air gaps. For instance, the aluminum substrate can bepunched to create a first aluminum substrate, a second aluminumsubstrate, and a third aluminum substrate. A first gap can separate thefirst aluminum substrate from the second aluminum substrate. A secondgap can separate the second aluminum substrate from the third aluminumsubstrate. Bridges can connect the aluminum substrate sub-elements.

At (406), the aluminum substrate sub-elements can be pretreated using alaser pre-treatment process and/or a screen printing process to addcircuit elements, traces, and connection layers (e.g., metallizedlayers) for the electronic power module. For instance, thick filmdeposition of metal layers on the aluminum can be accomplished using thetechniques described in U.S. Patent Application Publication2015/0044360, which is incorporated herein by reference. An examplelaser pretreatment process is disclosed in U.S. Provisional ApplicationSer. No. 62/792,153, which is incorporated herein by reference.

At (408) discrete components (e.g., surface mount devices) can bemounted and electrically connected to the aluminum substratesub-elements (e.g., using surface mount techniques). The discretecomponents can include the semiconductor switching components (e.g.,Silicon MOSFET, Si IGBT, Si FET, SiC MOSFET, SiC Shottky diodes, GaNHEMT, etc.). The discrete components can include sensors, such ascurrent sensors, temperature sensors, voltage sensors, etc. The discretecomponents can include passive components, such as resistors, diodes,capacitors, pin connectors, bond preforms, etc. At (410), if using baredies for the semiconductor switching components (e.g., see FIG. 2 andFIG. 4 ), the semiconductor switching components can be wire bonded andor ribbon bonded to the aluminum substrate sub-elements.

The aluminum substrate sub-elements can then be optionally secured to aheat spreader. The heat spreader can be, for instance, an aluminum sheethaving a thickness in the range of about 4 mm to about 6 mm. In someembodiments, the heat spread can be thinner, such as about 1.5 mm togain height for screwing connections of the power module. The aluminumsubstrate sub-elements can be secured to the heat spreader via asuitable isolating layer (e.g., adhesive tape).

At (412), the method can include punching the bridges between thealuminum sub-elements to fully separate the aluminum substratesub-elements. The gaps between aluminum substrate sub-elements canoptionally be filled with isolating material, such an epoxy resin,silicone-based material, potting compound, etc. The power electronicmodule can then be packaged by encasing at least a portion of thealuminum substrate sub-elements in a packaging material (e.g., plastic).

While the present subject matter has been described in detail withrespect to specific example embodiments thereof, it will be appreciatedthat those skilled in the art, upon attaining an understanding of theforegoing may readily produce alterations to, variations of, andequivalents to such embodiments. Accordingly, the scope of the presentdisclosure is by way of example rather than by way of limitation, andthe subject disclosure does not preclude inclusion of suchmodifications, variations and/or additions to the present subject matteras would be readily apparent to one of ordinary skill in the art.

What is claimed is:
 1. A method of manufacturing an electronic powermodule, the electronic power module comprising a first substrateoperable at a first potential; a second substrate operable at a secondpotential, the second substrate arranged in a common plane with thefirst substrate; a third substrate operable at a third potential, thethird substrate arranged in a common plane with the first substrate andthe second substrate; a first gap separating the first substrate fromthe second substrate; a second gap separating the second substrate fromthe third substrate; a first semiconductor switching componentelectrically coupled to the first substrate and the second substrate;and a second semiconductor switching component electrically coupled tothe second substrate and the third substrate, the method comprising:punching the first substrate, the second substrate, and the thirdsubstrate from a sheet of metal such that the first gap separates thefirst substrate from the second substrate and the second gap separatesthe second substrate from the third substrate; the first substrateconnected to the second substrate by one or more bridges; the secondsubstrate connected to the third substrate by one or more bridges;screen printing one or more circuit components on the first substrate,the second substrate, and the third substrate; connecting the firstsemiconductor switching component to the first substrate and the secondsubstrate; connecting the second semiconductor switching component tothe second substrate and the third substrate; covering the firstsubstrate, the second substrate, and the third substrate with apackaging material.
 2. The method of claim 1, further comprising: priorto covering the first substrate, the second substrate, and the thirdsubstrate with a packaging material, punching the one or more bridgesconnecting the first substrate and the second substrate and the one ormore bridges connecting the second substrate and the third substrate toseparate the first substrate from the second substrate and to separatethe second substrate from the third substrate.
 3. The method of claim 1,further comprising: prior to covering the first substrate, the secondsubstrate, and the third substrate with a packaging material, fillingthe first gap and the second gap with an isolation material.
 4. Themethod of claim 3, wherein the isolation material comprises anepoxy-resin.
 5. The method of claim 1, further comprising: attaching thefirst substrate, second substrate, and the third substrate to a heatspreader.
 6. The method of claim 5, wherein attaching the firstsubstrate, the second substrate, and the third substrate to the heatspreader comprising attaching the first substrate, the second substrate,and the third substrate to the heat spreader via an isolation layer.